Global intelligent systems leader Advantech (2395.TW) has partnered with Mitsubishi Electric, Omron, NEC, IBM Japan, and Oracle Japan to establish the “Edgecross Consortium” to overcome boundaries between companies and industries in order to realize collaboration between factory automation (FA) and IT. The objective is to create new value centered on edge computing. The joint press conference to announce the establishment of the Edgecross Consortium was held on November 6, 2017, in Tokyo, Japan, and the establishment of the consortium is planned for November 29, 2017.
Toshiba’s unmatched capability for the design and production of innovative, energy efficient and highly reliable solutions presents ESTÍA 5 series air-to-water heat pump solutions.
Emerson announces a major update to the ASCO Numatics G3 Series electronic valve island platform, enabling a reduction in installation costs. The valve island has been expanded so that it can control up to 128 solenoid valves on a single valve island assembly. This allows more valves to be controlled from a single node, enabling savings in the number of nodes and the cabling, internal tubing and electrical connections in the cabinet. Customers will benefit when they control a high density of valves or pneumatic equipment in a packaging plant or on a skid.
The latest addition to the Modulon DPH series of modular UPS systems has achieved the world’s highest per-rack power density while offering a range of benefits for mission critical applications such as large datacenters.