At Booth 236131, igus will present live demonstrations of e-chain energy supply systems, iglide plain bearings, drylin linear motion and automation technologies for manufacturing applications.
Standardized automation, data architecture and Digital Twin capabilities aim to connect research with scalable production while reducing integration complexity and scale-up risks.
Ceva and LG Electronics collaborate to integrate baseband IP and RF technologies into a silicon-ready Ultra-Wideband platform for automotive, industrial, and consumer SoCs.
Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
MASTERLY aims to accelerate the transition from traditional mass production to highly flexible, reconfigurable, and human-centric manufacturing systems.
HERON 300 HV combines robotic additive manufacturing, CNC machining, automation and AI to support distributed production of large industrial parts domestically.
ECP & ENP connectors combine power, signal and data transmission, supporting modular machinery, cabinet-free automation and reliable standardized connectivity across applications.