At CES 2026, TDK demonstrates new sensor, power, and haptic platforms that strengthen AI-enabled consumer, automotive, and industrial systems while debuting its “In Everything, Better” brand identity.
NVIDIA and Synopsys deepen collaboration using AI, CUDA acceleration, and Omniverse digital twins to transform simulation speed, scale, and engineering workflows.
Rockwell Automation introduces an elastic, cloud-native MES designed to unify OT and IT while improving flexibility, visibility, and resiliency in modern manufacturing.
Celebrated for pioneering solutions in electrification, robotics, and smart manufacturing, strengthening long-term Italy–China industrial collaboration.
Melexis introduces a dual-input inductive sensor interface designed to deliver stable 16-bit position measurement for robotics, industrial systems, and mobility applications.
Fraunhofer IPMS develops integrated inline sensor systems to enable real-time soil, water, and hydrogen infrastructure monitoring in Lusatia’s sustainable transformation.
Developed by SEGULA Technologies with Nodus Factory, these UHMWPE-based lifting slings target safer, lighter and metal-free load handling in industrial environments.