Telit Cinterion and Nokia are collaborating to integrate multi-access wireless connectivity with in-network edge computing for mission-critical industrial operations.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
Rosenberger Optical Solutions & Infrastructure implements large-scale AI data centre cabling projects across Europe in cooperation with a leading AI computing provider and end customer Microsoft.
Honeywell will supply integrated LNG pretreatment and liquefaction technologies to Commonwealth LNG’s planned export terminal in Louisiana under an agreement with Technip Energies, supporting faster execution and scalable gas processing.
Marley Engineered Products expands its infrared heater portfolio to address efficiency, spatial constraints, and operational stability in aircraft maintenance and storage facilities.
Fives presents low-carbon cement and recycling technologies at Construction & Demolition Recycling Association CDRA 2026 in Tampa, January 27–29, 2026.
The new AIB-AT platforms expand Aetina’s DeviceEdge portfolio with high-performance, low-latency computing designed for industrial robotics and emerging physical AI applications.