PEPPERL+FUCHS PROCESS AUTOMATION

ecom presents real-time solutions for efficient asset management

ecom, a Pepperl+Fuchs brand, addresses the topics of asset tracking and automation in times of digital transformation at the SPS IPC Drives 2017 in Nuremberg from November 28th to 30th. In hall 7A, booth 330, the specialist for industrial communication, mobile computing and explosion protection demonstrates how companies can implement and put IIoT-solutions to profitable use: including innovative solutions for real-time localization and an efficient, interconnected asset management.

IDS Imaging Development Systems GmbH

Robust 3D camera with IP65/67 for harsh ambient conditions

With the X30 FA and X36 FA, the industrial camera manufacturer IDS is launching two more models from its 3D camera system Ensenso X. Both new models are specifically designed for use in harsh ambient conditions. All components fulfill the requirements of the IP65/67 protection class and are therefore effectively protected against dirt, dust, water splashes, or cleaning agents. The 3D camera system combines a powerful projection module with a Gigabit Ethernet switch and two GigE uEye FA cameras with a 1.3 megapixel CMOS sensor that can be mounted at different distances. In addition to the baseline, the vergence angle and focal distance can also be freely selected, thus allowing the solution to be individually tailored to any 3D-vision requirement.

Advantech

Advantech Partners with 5 Global Leading Companies on Co-creating “Edgecross Consortium” for Accelerating Global Industry 4.0 Growth

Global intelligent systems leader Advantech (2395.TW) has partnered with Mitsubishi Electric, Omron, NEC, IBM Japan, and Oracle Japan to establish the “Edgecross Consortium” to overcome boundaries between companies and industries in order to realize collaboration between factory automation (FA) and IT. The objective is to create new value centered on edge computing. The joint press conference to announce the establishment of the Edgecross Consortium was held on November 6, 2017, in Tokyo, Japan, and the establishment of the consortium is planned for November 29, 2017.

Asco

Emerson Announces High Density Pneumatic Valve Island, Enabling Reduced Installation Costs

Emerson announces a major update to the ASCO Numatics G3 Series electronic valve island platform, enabling a reduction in installation costs. The valve island has been expanded so that it can control up to 128 solenoid valves on a single valve island assembly. This allows more valves to be controlled from a single node, enabling savings in the number of nodes and the cabling, internal tubing and electrical connections in the cabinet. Customers will benefit when they control a high density of valves or pneumatic equipment in a packaging plant or on a skid.

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