04
'20
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Elesa + Ganter News
04
'20
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Hexagon Manufacturing Intelligence News
New RADAN Provides Ultimate Nesting for Punching Machines
“Massive Savings” and Quicker Nesting Production – plus Designer Enhancements.
04
'20
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Parker News
The Parker Service Master CONNECT: the robust, universally applicable handmeter offers customised solutions for customer-specific requirements
Parker Hannifin, the global leader in motion and control technologies, has introduced the Parker Service Master CONNECT, a strong diagnostic measuring device for mobile and stationary hydraulic applications, for example, in service, commissioning and in research and development. The device records measurements such as pressure, temperature, flow rate and rotational speed safely and accurately.
30
'20
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Stratasys News
New Stratasys J55 3D Printer Gives Designers Affordable, Office-friendly, Full-Color 3D Printing to Validate New Product Designs Quickly
Design-to-print workflow simplified with KeyShot and SOLIDWORKS software integration.
30
'20
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emka News
Smartphone-based access control: Innovation with inductive power supply
A locking solution for passive outdoor control cabinets or telecommunication housings also referred to as multifunctional housing.
30
'20
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Stauff News
COMPACT PLUG-IN COUPLING WITH PUSH-PULL SLEEVE
With the revised QRC-ID coupling series, Stauff presents a new product that was developed especially for stationary hydraulics. The essential design features include convenient operation, compact dimensions and particularly high corrosion resistance.
29
'20
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PEPPERL+FUCHS PROCESS AUTOMATION
Digital Products & Services: Driving digitization with mobile devices
ecom, a Pepperl+Fuchs brand, presents its expanded product portfolio. Special focus this year is on the new product line “Digital Products & Services”.
29
'20
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HARTING Europe
Component carrier now replacing flexible PCBs
Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved.
29
'20
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EPLAN
