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Broadcom News
BROADCOM DELIVERS ON AI INFRASTRUCTURE VISION WITH INDUSTRY-LEADING SOLUTIONS
Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project (OCP) Global Summit.
www.broadcom.com
Broadcom announced that momentum continues to build in support of its vision of enabling AI infrastructure through a combination of open standards, scalability, and power-efficient solutions. The 2024 Summit takes place in San Jose, Calif. from Oct. 15-17. Highlights regarding Broadcom’s participation in this year’s Global Summit can be found here.
As AI clusters expand to a million nodes, managing energy consumption becomes crucial, necessitating power-efficient and high-performance connectivity solutions. Further, open standards like Ethernet and PCIe play a vital role offering interoperable and time-to-market solutions for the rapidly growing AI infrastructure market.
At this year’s summit, Broadcom will showcase several innovations that power its comprehensive portfolio of Ethernet, Ethernet NIC Adapters, Co-Packaged Optics (CPO), PCIe switches and retimers, and Sian2 optical networking products. Broadcom’s AI architects and engineers will also deliver key talks and technical panels covering topics across our broad AI infrastructure solutions. The final agenda will be available here.
At the summit, several cutting-edge AI solutions will be featured including:
- Ethernet networking switches like the Tomahawk 5 and Jericho3-AI designed to accelerate AI/ML workloads.
- The Trident4-X11 Ethernet switch engineered to create the front-end fabric that interfaces with the back-end AI fabric.
- Tomahawk 5 - Bailly, the world's leading 51.2 Tbps CPO Ethernet switch, which combines advanced silicon photonics CPO technology with Broadcom's Tomahawk 5 switch chip, setting a new benchmark for power efficiency and performance in AI infrastructure.
- High-performance, low-power 400G PCIe Gen 5.0 Ethernet adapters, developed as open, standards-based solutions to address connectivity challenges as XPU bandwidth increases and AI data center clusters expand.
- PCIe Gen 5.0 switches, which are the open, standards-based fabric of choice for AI connectivity; drawing half the power of alternatives, with industry leading SerDes, telemetry and diagnostics.
- The industry's first PCI Express Gen5/Gen6 retimers, offering ultra-low power solutions to enhance efficiency and scalability in AI infrastructure.
- Sian and Sian2 DSPs, supporting 200G/lane pluggable modules for connecting next-generation AI clusters.
