CEA-Leti, founded in 1967 and based in Grenoble, France, is a leading global research institute specializing in microelectronics and nanotechnology. As part of the French Alternative Energies and Atomic Energy Commission (CEA), CEA-Leti focuses on technological research and development, driving innovation in areas such as semiconductors, photonics, healthcare technologies, and wireless communication. The institute collaborates with industry partners worldwide to transfer its cutting-edge technologies into commercial applications, emphasizing sustainability, miniaturization, and energy efficiency. With a strong commitment to advancing science and technology, CEA-Leti plays a pivotal role in shaping the future of electronics and information technologies.
CEA-Leti scientists achieved three key projects at ECTC 2024, enabling a new generation of CMOS image sensors capable of utilizing all image data to perceive, understand, and intervene in scenes, requiring AI embedding.
CEA-Leti at IEDM 2023 has described the world’s-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.
CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".
CEA-Leti scientists have demonstrated a machine-learning technique exploiting what have been previously considered as “non-ideal” traits of resistive-RAM (RRAM) devices, overcoming barriers to developing RRAM-based edge-learning systems.