Innodisk is leading the way and launching new InnoEx Virtual I/O Expansion Module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.
Traditional attendance fairs are back after the Corona pandemic, but digital fairs remain a flexible tool for showcasing innovations and new technical solutions. Schmersal has completely overhauled its digital fair concept to present current products from the company in automation technology and machine safety, as well as a range of smart safety solutions.
Aethertek selected Keysight Open RAN Studio to test the end-to-end performance of its radio frequency front-end modules and millimeter wave phase array antennas.
New contracts signed totalling 2.25 GW, bringing total managed power worldwide to over 22 GW, which is the energy consumed by more than 22 million households.
The company’s innovation provides accurate data on the potential for damage from each lightning strike. Vagasky also used the improved data at the American Meteorological Society Annual Meeting to finally answer a question causing debate amongst meteorologists.
Infineon Technologies AG is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021.
To optimize the setup and integration of new products into existing machines and solutions, the experts at Panasonic Industry offer a close exchange with customers to configure the most suitable customized solution in terms of product modification, packaging, labeling, and pre-assembly and additional features.