16
'24
16
'24
Written on
norelem
WHY THE USA IS THE PERFECT MOVE FOR EUROPEAN MANUFACTURERS
norelem CEO Marcus Schneck explains the benefits that the company is bringing to American design engineers as it enters the US market.
16
'24
Written on
Delta Electronics
Delta Unveils a Total Cutting-edge Power and Cooling Solution Tailored for the NVIDIA MGX Platform at OCP Global Summit 2024
.
16
'24
Written on
Air Liquide News
Air Liquide to supply oxygen to LG Chem for their U.S electric vehicle battery plant
The Group will invest around 150 million US dollars to expand its production capacity and pipeline network for supplying oxygen to LG Chem's future cathode active material plant in Tennessee.
16
'24
Written on
TE Connectivity News
TE Connectivity Showcases Innovative Connectivity and Sensor Solutions at SPS 2024
TE showcases solutions for production, automation, network technology, smart infrastructures and drive technology for mobile systems and robotics.
16
'24
Written on
Gossen Metrawatt News
Compact earthing resistance and low-resistance measuring instrument
Gossen Metrawatt expands its METRALINE product family, adding the new METRALINE EARTH for professional measurement of earthing resistance and for low-resistance measurements with a test current of ≥200 mA according to EN 61557-4 / VDE 0413-4.
16
'24
Written on
Mitsubishi Electric US
Mitsubishi Electric Automation, Inc. Exhibiting Latest Robotic Solutions and Automation Technologies at PACK EXPO 2024
Join Mitsubishi Electric Automation at McCormick Place in Chicago, IL, from November 3rd to 6th to discover solutions for Perfecting Packaging Performance at booth #4916.
15
'24
Written on
Delta Electronics
Delta’s Energy-Saving Power and Liquid Cooling Solutions for AI and HPC Data Centers Unveiled at OCP Global Summit 2024
.
15
'24
Written on
Nord USA
NORD DRIVESYSTEMS Presents Complete Packaging Drive Solutions at PACK EXPO
NORD offers intelligent, reliable, and cost-efficient solutions for the entire packaging process including primary packaging, secondary packaging, end-of-line packaging, and higher-level applications.
15
'24
Written on
MvTec News