TDK to showcase solutions for automotive, IoT, AR/VR, and consumer electronics at Sensors Expo & Conference 2019
TDK Corporation (TSE: 6762) will present the industry’s single source of innovative sensor solutions marketed under brands TDK, EPCOS, InvenSense, Micronas, Chirp, and Tronics in Booth #416 at Sensors Expo and Conference 2019, McEnery Convention Center, June 26-27, San Jose, Calif.
TDK will also present at the Sensors Expo Pre-Symposium on June 25.
- TDK Corporation to highlight industry’s most comprehensive portfolio of sensors and passive components from brands including TDK, Chirp, InvenSense, Micronas, EPCOS, and Tronics.
- Solutions address real-world applications such as AR/VR, robotics, IoT, automotive, consumer electronics, and sound systems.
TDK’s portfolio meets the growing and diverse demand for sensor technologies in the automotive, industrial equipment, consumer electronics industries and beyond.
The exhibition will include the following sensor solutions:
TMR-based Current Sensor: The first Micronas TMR-based sensor family CUR 42xy was developed for current measurements in Automotive and Industrial applications and is marketed under the trademark curSENS. The CUR 423x sensors allow for non-intrusive, galvanically isolated contactless current measurements based on closed-loop TMR technology.
The sensors are ISO26262 ASIL-B ready and AEC-Q100 qualified. A very good signal-to-noise ratio and a total error below 1% (full scale) over temperature enable precise current measurements and the smallest module integration since no magnetic-field core concentrator is required.
TMR Angle Sensor: The TDK TMR angle sensor, TAD2141 with digital output, offers a guaranteed accuracy of ±0.2 °. At room temperature, the sensor achieves an accuracy for angle error of only ±0.05°.
The sensor is capable of contactless sensing 360 ° within a temperature range of -40 °C to +150 °C. The main applications of the sensor include industrial and robotics, as well as automotive with a focus on future systems for automated driving.
Direct Angle Sensors: The Micronas Hall-sensor family HAL® 39xy featuring stray-field compensation capability was built on the highly flexible architecture for multidimensional magnetic-field measurements, marketed under the trademark masterHAL®.
It offers four different measurement modes in a single device: linear position detection, rotary 360° angle detection and rotary 180° angle detection with stray field compensation including gradient fields as well as the capability for real 3D magnetic field measurement (BX, BY, BZ).
MEMS Gyroscopes : The Tronics GYPRO® high-performance MEMS gyroscopes product line has been specifically designed for applications that are more demanding than automotive, while not requiring “tactical grade” FOG (Fiber Optic Gyros) or DTG (Dynamically Tuned Gyros). GYPRO® offers high bias stability, low noise and low latency. Tronics's closed-loop gyroscopes product family is ideal for precision navigation and stabilization applications
MEMS Accelerometers : The Tronics AXO® high-performance MEMS accelerometers take MEMS acceleration sensors to a new level of performance thanks to their closed-loop architecture. Tronics AXO® complements the industry-standard GYPRO® product line. It offers low noise, high bias stability and excellent linearity over temperature, and is well suited to precision navigation applications.
BioMEMS: Tronics customizable BioMEMS products include flexible polymer based sensors, conductive and functionalized silicon microneedles, and microfluidic sensors for use in the medical wearable, point of care, and diagnostic markets. Devices are fabricated in an ISO 9001:2017 and ISO 13485:2016 certified US based cleanroom.
Temperature and Pressure Sensors: High-accuracy temperature and pressure sensors with excellent media resistance and long-term stability, serving the automotive, industrial and consumer electronics markets. The EPCOS H650 temperature sensor element is designed for measuring temperatures up to 650 °C.
The NTC sensor element offers high-precision measurement with a temperature tolerance of about ±1 K at 200 °C. New high performance and long-term stable EPCOS pressure sensing elements are designed for pressure ranges of 100 mbar up to 40 bar; down to a size of 0.65 mm x 0.65 mm.
MEMS Microphones: TDK and InvenSense microphones fit in all mobile, IoT, and wearable solutions where low power, high fidelity, tight sensitivity matching and high acoustic overload point (AOP) are important.
Multi-mode microphones are ideal in ‘AlwaysOn’ applications where the current consumption is significantly reduced in low-power mode. InvenSense is the only company offering a high SNR and AOP multi-mode solution for both analog (ICS-40618/40619) and digital (ICS-41350) microphones.
Ultrasonic ToF Sensors: The Chirp CH-101 is the first commercially available MEMS-based ultrasonic time of flight (ToF) sensors intended for consumer electronics, AR/VR, robotics, drones, IoT, automotive, and industrial market segments.
The Chirp Microsystems ultrasonic product portfolio also includes the CH-201 ultrasonic ToF sensor and Chirp’s SonicTrack™, an ultrasonic six-degree-of-freedom (6-DoF) sensor fusion library to make inside-out 6-DoF tracking available.
MEMS Motion Sensors: Accurately tracking complex user motions require the use of motion sensors such as gyroscopes, accelerometers, compasses, and pressure sensors, fusing the sensor outputs into a single and accurate data stream for use as input commands in consumer, industrial, and automotive solutions.
InvenSense’s latest chip, the ICM-42605 is a 6-axis MotionTracking device that combines a 3-axis gyroscope and 3-axis accelerometer, in a small 2.5 x 3 x 0.91mm (14-pin LGA) package. A comprehensive development platform is also available for ICM-42605 to help customers evaluate and develop applications.
Similarly, the IAM-20680 is also a 6-axis MotionTracking device designed specifically for automotive applications; it combines a 3-axis gyroscope, and a 3-axis accelerometer in a small, 3mm x 3mm x 0.75mm (16-pin LGA) package.
The IAM-20680, with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance.
Dr. Sreeni Rao, senior director, Gas and Environmental Sensing at TDK, will present at the Sensors Expo Pre-Symposium on real-world applications for MEMs and sensors on June 25. From 9:15-10 a.m. PST, Dr. Rao will discuss gas sensing technology advances for at-home and consumer healthcare applications.
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