AEWIN Showcases Rack-Scale AI Infrastructure and Two-Phase Direct Liquid Cooling at COMPUTEX 2026
AEWIN presents AI server platforms, high-density storage systems, and two-phase direct liquid cooling technologies designed to support large-scale AI workloads with improved energy efficiency, thermal management, and deployment scalability.
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AEWIN Technologies will showcase its next-generation AI data center and cybersecurity infrastructure at COMPUTEX 2026. The showcase highlights the integration of rack-scale AI servers and two-phase direct liquid cooling solutions. By integrating advanced computing, high-speed networking, and enterprise storage, AEWIN empowers enterprises to build AI-ready environments for real-time analytics and large-scale data processing. The architecture accelerates AI deployment with enhanced energy efficiency and optimized TCO.
AEWIN Technologies participates in the BenQ Group COMPUTEX AI IN ACTION exhibition and exhibits rack-scale AI Infrastructure integrating AI servers, performant network appliances, and two-phase direct liquid cooling solutions on the 4th floor of Hall 1, Taipei Nangang Exhibition Center from June 2 to June 5. The booth number is M0104, and the BenQ Group companies will create a smarter and more sustainable future together.
The showcased high performance AI servers are powered by next generation AMD EPYC processors for high-density compute. The product portfolio includes 1U 2P DLC Server supporting dual GPUs, 2U AI server supporting up to four GPU cards, and 5U liquid-cooling system supporting up to 16 GPU cards. Additionally, there are high-speed storage servers featuring 24 U.2 or 32 E3.S SSDs, which are suitable for demanding workloads such as generative AI, model training, inference, and large-scale data processing.
Together with its subsidiary Arivor Technologies, AEWIN will display a rack-scale 2P DLC (Two-Phase Direct Liquid Cooling) solution for AI and high-density computing infrastructure exceeding 100kW per rack. Leveraging low-boiling-point phase-change cooling technology, it supports next-generation chips above 3000W while improving thermal efficiency and reducing data center PUE. AEWIN will also demonstrate high-end gaming systems and Microchannel Lid (MCL) applications supporting chips beyond 5000W to present the extensibility of the cooling technology.
In addition, AEWIN will also showcase a range of server and network platforms optimized for Edge AI, storage, and cybersecurity applications. Highlights include the BIS-5231, dual-socket general-purpose server with up to eight PCIe Gen5 slots, the compact BAS-6101 edge AI platform, the MIS-5131 2U2N high-availability storage server, and the SCB-1953 network appliance powered by Intel Xeon 6 processors with Intel QAT acceleration. These platforms deliver high-throughput computing, accelerated encryption, and enhanced data processing efficiency for modern AI and security workloads.
By integrating computing, cooling, and cybersecurity technologies, AEWIN demonstrates its capability to build scalable AI infrastructure for next-generation data centers. Through continuous innovation and close collaboration with leading industries, AEWIN is helping enterprises address the increasing demands of AI computing, bandwidth, and thermal management through high-performance and sustainable infrastructure.
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