The new CoLab application center at the Brackenheim-Hausen location provides enough space for customers to test their automation solutions in a realistic surrounding, and to get them validated by SCHUNK experts. The focus of the application center is particularly on new technologies and fields of application.
3D Systems (NYSE:DDD) today announced its introduction of a novel High Speed Fusion industrial 3D printer platform and material portfolio. Developed in a collaboration with Jabil Inc. (NYSE:JBL), this unique HSF TM family of products, including the Roadrunner TM 3D printer, is expected to provide the best economics of any high throughput industrial fused-filament offering in the market today.
As general contractor, KUKA was responsible for the AGV system integration in the entire body shop: from the development of the safety concept, through planning, engineering, simulation and project management. A milestone was set in the AGV supported production of vehicle bodies.
OnRobot’s new VGP20 electric vacuum gripper provides a powerful and versatile solution for challenging palletising scenarios including heavy, bulky and porous surfaces.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “MG800FXF2YMS3,” a silicon carbide (SiC) MOSFET module integrating newly developed dual channel SiC MOSFET chips with ratings of 3300V and 800A, for industrial applications. Volume production will start in May 2021.