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'21
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Vision Components News
01
'21
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CEVA News
CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds
Companies collaborate to bring complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs. CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, together Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the technology leader in 3D spatial audio technologies, today announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing.
01
'21
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Tungaloy News
New AddForceCut Parting and Deep Grooving System Features Optimally Rigid Self-Clamping Insert System to Ensure Extra Stability and Reliability
Tungaloy unveils AddForceCut deep grooving and parting-off tool system that maximizes tool stability. Using a single-ended insert and secure insert self-clamping system, AddForceCut improves chip control and evacuation during deep grooving and parting off operations.
01
'21
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Lane Electronics News
Wide Range of Positronic industry standard D-Sub high reliability connectors for Military, Aerospace and Industrial applications available from Lane Electronics
Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, is an authorised distributor for Positronic, a market leading manufacturer of high reliability signal and power connectors providing mission critical performance.
01
'21
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Binder News
Simplify safe signal transmission in sensor-actuator applications
Field-wireable M8 signal cable connectors from binder support efficient and reliable installations in sensor and actuator applications. Featuring snap-in quick locking and now offered with 3 to 6 pins, they prove themselves in industrial applications that require reliable signal transmission and are subject to installation space constraints.
01
'21
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Microsys News
MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform
MicroSys miriac embedded modules and platforms combined with Hailo-8 AI acceleration modules offer a high-performance, scalable embedded platform for AI processing at the edge, with applications in fields such as Industry 4.0, automotive and heavy machinery.
01
'21
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Timestrip News
Timestrip Introduces New Vaccine Temperature Indicator
Smart Indicator Avoids Wastage of Vaccine Supplies. Timestrip®, the developer of smart indicator technology, has introduced a new temperature indicator that helps healthcare professionals avoid wastage of vaccines. Travelling with packs of vaccine vials, the Vaccine Freezer Monitor ‘VFM -7⁰C’ is activated just when monitoring is required.
01
'21
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Rohm Semiconductors News
ROHM REVISES ITS GREENHOUSE GAS EMISSION REDUCTION TARGETS FOR 2030 TO ACHIEVE A DECARBONIZED SOCIETY
Includes support for the recommendations of the Task Force on Climate-related Financial Disclosures.
01
'21
Written on
Renesas News
Renesas Introduces Industry’s Highest Performance Entry-Line MCUs
New RA6E1 Group Based on Arm® Cortex®-M33 Delivers 200 MHz Performance in Addition to Low Power Performance.
01
'21
Written on
Yamaha Motor News
