Softing Industrial Automation GmbH

Software Multiplexer for easy connection of Allen-Bradley and Schneider Electric HART modules to Emerson's AMS Device Manager

Softing Industrial introduces smartLink SW-HT – a HART multiplexer software for accessing configuration and diagnostic data via Emerson's AMS Device Manager or other HART IP-enabled plant asset management applications. Version 1.10 supports Allen-Bradley controllers and remote I/Os in addition to Schneider Electric M580 controllers and drop I/Os.

Wabtec News

Wabtec Opens Its Largest Engineering Lab in India

Wabtec Corporation, a leading technology supplier for the freight and transit rail industries, inaugurated today a world-class global engineering lab in Bengaluru, India to enable rail component design and performance

Rohde & Schwarz

Rohde & Schwarz validates 10 Gbps end-to-end (E2E) peak downlink IP data throughput

Rohde & Schwarz announced today the next breakthrough in 5G data performance: With support of Qualcomm Technologies, Inc., Rohde & Schwarz has validated 10 Gbps end-to-end (E2E) IP data performance using its R&S CMX500 5G radio communication tester platform. The setup was powered by Snapdragon® X65 5G Modem-RF System, the world’s first 3GPP Release 16 modem-RF system with Qualcomm® QTM545 mmWave Antenna Module.

Bunting europe News

Bunting at Ecomondo

With the Ecomondo Green Technology Expo encompassing the circular economy, the Bunting stand (hall A2 stand 007) focuses on material recycling through material and metal separation to neodymium magnet recovery.

Phoenix Contact News

THR PCB terminal blocks up to 2.5 mm²

Phoenix Contact is extending its range of reflow-solder-capable PCB terminal blocks (MSL1) to include the 2.5 mm² cross-section.

AT&S News

AT&S continues to invest in its Leoben site

In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger focus on research and development. Therefore, the company is investing in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg. In addition, another technology upgrade of the production facilities will be implemented.

Join the 155,000+ IMP followers