12
'23
Written on
Andritz News
12
'23
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Baumer News
BAUMER PRESENTS INDUSTRIAL CAMERA WITH INTEGRATED COOLING PIPE
Baumer's industrial cameras with integrated cooling pipes ensure temperature stability in a compact design.
11
'23
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Baumüller News
BAUMÜLLER PRESENTS PRECISE AND MODULAR DRIVE SOLUTIONS FOR THE TEXTILE INDUSTRY AT ITMA
At ITMA from June 8 to 14, 2023, the topics of Advanced Materials, Automation & Digital Future, Innovative Technologies, and Sustainability & Circularity will be in the spotlight.
11
'23
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SICK News
SICK's multiScan Masters provides precision 3D LiDAR navigation and collision avoidance
SICK multiScan combines 360° environment perception with high-resolution navigation for reliable real-time localisation, mapping and collision avoidance.
11
'23
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Voith News
Voith presents sustainable and efficient innovations for optimized papermaking at ZELLCHEMING
The hybrid trade fair will provide a platform for forward-looking process and product technology innovations for the paper, pulp and fiber-based industries.
11
'23
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iBASE News
Rugged COM Express CPU Module with Intel Atom x6000 Processors
IBASE Technology Inc, has released the ET880 COM Express CPU module to meet the needs of embedded applications with low power consumption and fanless operation.
11
'23
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Infineon News
Infineon's CALYPSOTM move enables interoperable ticketing solutions based on open standards
Infineon Technologies AG has developed CALYPSOTM move, a secure memory for contactless ticketing, to meet the specific requirements of each transport operator and authority.
11
'23
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Mediatek News
MEDIATEK LAUNCHES DIMENSITY 9200+ CHIPSET FOR FLAGSHIP 5G SMARTPHONES
The company’s new chipset features performance boosts and significant power savings for top-of-the-line smartphones.
11
'23
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Vision Components News
VC TO PRESENT NEW MIPI CAMERA MODULES AND COMPONENTS AT THREE TRADESHOWS
The highlight at the events will be the FPGA-based hardware accelerator VC Power SoM, which completes complex image processing calculations and transfers the results directly to a processor board.
11
'23
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INTERROLL
