Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements.
ST’s complete certified technology platform combines embedded secure element and ultra-low-power general-purpose microcontroller for cost-effective and robust protection.
Siemens Smart Infrastructure has partnered with OverIT, the global leader in field service management, to expand its ecosystem of partners for its grid software business. Headquartered in Italy, OverIT offers a software solution to boost productivity in workforce management and create data analytics to track, calculate and analyze field service operations.
A leading German ceramic manufacturer is cleaning ceramic glaze with a high-intensity Electro Magnetic Filter designed and manufactured by Bunting. The successful removal of fine magnetics reduces finished product rejects and increases surface brightness.
Leveraging proprietary PCB electrical and mechanical design topologies, Murata has introduced a new series of compact DC-DC converters that are aligned with the increasing prevalence of wide bandgap technology. The new MGN1 series of 1W output DC-DC converters are designed to deliver the voltages needed by the gate drivers of GaN devices.
Researchers at the University of Wisconsin–Madison, the first U.S. clinical evaluation site for GE Healthcare’s industry-first silicon-based photon counting CT, will begin human scanning using the device, which is engineered with Deep Silicon detectors with the goal of greatly enhancing imaging capabilities to help clinicians improve patient outcomes across oncology, cardiology, neurology, and other clinical CT applications.
Parker Hannifin, the global leader in motion and control technologies, has launched an extended range of cryogenic thermal relief valves in stainless steel with the option of integrated two ferrule A-LOK® connections.
AddUp and Dassault Aviation are collaborating to move metal additive manufacturing processes from "prototyping" to "mass production" for aeronautics. To achieve this, additive technology must be optimized to demonstrate its capabilities in terms of quality, reproducibility, and productivity, to consider the mass production of metal parts that will then be integrated into aircraft.
Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD’s Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk’s FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.