01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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NEC Corporation News

QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Parker News

Parker Introduces New Catalogue Featuring Bestobell Cryogenic Valves for Industrial Gas Applications

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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PEI-Genesis News

Shield your customers from global supply issues

PEI-Genesis advises on how to provide stability for customers during uncertain times.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Moxa News

Futureproof Mobile Automation with Moxa Next-Generation Industrial Wi-Fi Access Points/Clients

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Advantech News

Advantech: Demonstrating AI at the cutting 'Edge' of embedded technologies

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Rohde & Schwarz

Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems

Embedded systems are at the core of today’s electronic devices, whether in consumer electronics, telecommunications, industrial, medical, automotive or aerospace applications. Flawless operation is crucial, and engineers face complex challenges when designing ever more compact embedded systems which meet today’s demands of efficiency, safety, reliability and interoperability. Rohde & Schwarz addresses these challenges with its wide-ranging test and measurement solutions showcased at the embedded world Exhibition & Conference 2023 in Nuremberg.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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RÖSBERG Engineering GmbH

Plant Documentation 4.0 – an essential enabler for Industry 4.0

Specialist articles on Industry 4.0 generally emphasize the aspect of technical feasibility of the consistent, intelligent networking of machines, processes and personnel: What gateways, protocols and platforms will be needed to interlink machines from different manufacturers? What legal requirements have to be observed? How can security be designed to avoid hacker attacks?.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Binder News

BINDER - PROTECTED COMPREHENSIVELY AGAINST CORROSION

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Neugart

New PM2 pinion series for maximum feed rate

Additional gearbox/pinion combinations for rack-and-pinion drives.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-01T00:00:00+00:00" | date "longDate" }}

Infineon News

New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

Read more…

Case studies

IDS multi-camera AI system enables fully automated, defect-free inspection in metalworking and automotive

QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Parker Introduces New Catalogue Featuring Bestobell Cryogenic Valves for Industrial Gas Applications

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

Shield your customers from global supply issues

PEI-Genesis advises on how to provide stability for customers during uncertain times.

Futureproof Mobile Automation with Moxa Next-Generation Industrial Wi-Fi Access Points/Clients

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

Advantech: Demonstrating AI at the cutting 'Edge' of embedded technologies

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems

Plant Documentation 4.0 – an essential enabler for Industry 4.0

BINDER - PROTECTED COMPREHENSIVELY AGAINST CORROSION

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

New PM2 pinion series for maximum feed rate

Additional gearbox/pinion combinations for rack-and-pinion drives.

New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

International

Case studies

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

PEI-Genesis advises on how to provide stability for customers during uncertain times.

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

Additional gearbox/pinion combinations for rack-and-pinion drives.

Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

International

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.