NXP News

NXP’s S32K3 Automotive MCUs are Ready for AWS Cloud Services

S32K3-based zonal aggregators and end nodes can now access cloud services, further expanding cloud access across the S32 vehicle compute platform. New S32K3 capability provides automakers flexible cloud connectivity for new vehicle architectures.

Copadata News

COPA-DATA will participate at The BrauBeviale booth for your Net Zero transformation

COPA-DATA will be presenting its zenon software platform at BrauBeviale 2023 in Nuremberg from 28 to 30 November. The specialist for industrial software will show how the transformation process towards sustainable production can be innovatively and digitally designed.

CUI Devices News

CUI Devices Launches New Thermal Design Services

CUI Devices employs advanced simulation tools and decades of expertise to provide industry-leading thermal design services, identifying potential hotspots, optimizing airflow, and designing effective cooling systems tailored to customer needs.

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