15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK^® 1212-F

Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK^® 1212 F Package With Center Gate Design.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Kontron News

Limitless communication with new multilingual functionality

Kontron, offers industrial software for cross-industry automation solutions through its subsidiary Kontron AIS GmbH.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Thomson linear News

Thomson Adds High-Speed Option to its High-Load Ball Screw Family

With a diameter of 50 mm and an exceptionally high lead of 100 mm, the new ball screw can support high travel speeds in applications requiring a dynamic load capacity of up to 202.4 kN.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

HMS Industrial Networks AB

Anybus achieves maturity level 3 certification in IEC 62443-4-1 industrial cybersecurity standard

HMS Networks, the global leader in industrial network communication solutions, announces that its Anybus brand has successfully attained Maturity Level 3 (ML3) certification in the International Electrotechnical Commission (IEC) 62443-4-1: Secure product development lifecycle requirements, an industrial cybersecurity standard.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz collaborates with Sony Semiconductor Israel to reach milestones for NTN NB-IoT roll-out

Together, Rohde & Schwarz and Sony Semiconductor Israel (Sony) have achieved the industry’s first 3GPP Rel. 17 NTN NB-IoT RF performance verification.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Anritsu News

ANRITSU AND DEEPSIG REVOLUTIONIZING SPECTRUM SENSING WITH ARTIFICIAL INTELLIGENCE

This integrated solution will empower customers to enhance network performance, optimize spectrum utilization, and achieve real-time adaptation to changing RF conditions.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

Danfoss News

DANFOSS TO SHIFT PERSPECTIVES ON DECARBONIZATION OF HEATING AND COOLING AT MCE 2024

Danfoss announced its participation at Mostra Convegno Expocomfort (MCE) 2024, taking place from March 12-15 in Milan, Italy.

Read more…

15 {{ "2024-02-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-15T00:00:00+00:00" | date "longDate" }}

ABB Motion

UL Type 4X/IP66 Drive Supports Water Industry Applications in Extreme Environments

ABB has introduced the ACQ580 4X drive, a versatile drive designed for the water and wastewater industry. It can withstand harsh environmental conditions like rain, heat, cold, salt spray, and dust, ensuring reliable operation.

Read more…

14 {{ "2024-02-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-14T00:00:00+00:00" | date "longDate" }}

Cortec News

Fitting the Right Packaging to Oversized Metal Items with Cortec^® VpCI^® Film

VpCI^®-126 Film and Bags are a convenient solution for packaging and protecting various metal parts, preventing rusting for up to two years by simply inserting a small gear or bolt.

Read more…

14 {{ "2024-02-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-14T00:00:00+00:00" | date "longDate" }}

Tesmec News

Tesmec presents "Teo - Tesmec Evolution Onwards"

Tesmec is pleased to present "Teo - Tesmec Evolution Onwards," a new innovative digital eco-system dedicated to the world of stringing.

Read more…

Market Overview

The Transition of the HVAC Industry to New Refrigerants

Technical Articles

binder Connector presents PBC 15 female field-wirable and male panel mount

Case studies

Extending inspection intervals for ExxonMobil’s critical gas turbines

Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK^® 1212-F

Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK^® 1212 F Package With Center Gate Design.

Limitless communication with new multilingual functionality

Kontron, offers industrial software for cross-industry automation solutions through its subsidiary Kontron AIS GmbH.

Thomson Adds High-Speed Option to its High-Load Ball Screw Family

With a diameter of 50 mm and an exceptionally high lead of 100 mm, the new ball screw can support high travel speeds in applications requiring a dynamic load capacity of up to 202.4 kN.

Anybus achieves maturity level 3 certification in IEC 62443-4-1 industrial cybersecurity standard

Rohde & Schwarz collaborates with Sony Semiconductor Israel to reach milestones for NTN NB-IoT roll-out

Together, Rohde & Schwarz and Sony Semiconductor Israel (Sony) have achieved the industry’s first 3GPP Rel. 17 NTN NB-IoT RF performance verification.

ANRITSU AND DEEPSIG REVOLUTIONIZING SPECTRUM SENSING WITH ARTIFICIAL INTELLIGENCE

This integrated solution will empower customers to enhance network performance, optimize spectrum utilization, and achieve real-time adaptation to changing RF conditions.

DANFOSS TO SHIFT PERSPECTIVES ON DECARBONIZATION OF HEATING AND COOLING AT MCE 2024

Danfoss announced its participation at Mostra Convegno Expocomfort (MCE) 2024, taking place from March 12-15 in Milan, Italy.

UL Type 4X/IP66 Drive Supports Water Industry Applications in Extreme Environments

ABB has introduced the ACQ580 4X drive, a versatile drive designed for the water and wastewater industry. It can withstand harsh environmental conditions like rain, heat, cold, salt spray, and dust, ensuring reliable operation.

Fitting the Right Packaging to Oversized Metal Items with Cortec^® VpCI^® Film

VpCI^®-126 Film and Bags are a convenient solution for packaging and protecting various metal parts, preventing rusting for up to two years by simply inserting a small gear or bolt.

Tesmec presents "Teo - Tesmec Evolution Onwards"

Tesmec is pleased to present "Teo - Tesmec Evolution Onwards," a new innovative digital eco-system dedicated to the world of stringing.

International

Market Overview

Technical Articles

Case studies

Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK® 1212 F Package With Center Gate Design.

Kontron, offers industrial software for cross-industry automation solutions through its subsidiary Kontron AIS GmbH.

With a diameter of 50 mm and an exceptionally high lead of 100 mm, the new ball screw can support high travel speeds in applications requiring a dynamic load capacity of up to 202.4 kN.

Together, Rohde & Schwarz and Sony Semiconductor Israel (Sony) have achieved the industry’s first 3GPP Rel. 17 NTN NB-IoT RF performance verification.

This integrated solution will empower customers to enhance network performance, optimize spectrum utilization, and achieve real-time adaptation to changing RF conditions.

Danfoss announced its participation at Mostra Convegno Expocomfort (MCE) 2024, taking place from March 12-15 in Milan, Italy.

ABB has introduced the ACQ580 4X drive, a versatile drive designed for the water and wastewater industry. It can withstand harsh environmental conditions like rain, heat, cold, salt spray, and dust, ensuring reliable operation.

VpCI®-126 Film and Bags are a convenient solution for packaging and protecting various metal parts, preventing rusting for up to two years by simply inserting a small gear or bolt.

Tesmec is pleased to present "Teo - Tesmec Evolution Onwards," a new innovative digital eco-system dedicated to the world of stringing.

International

Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK^® 1212 F Package With Center Gate Design.

VpCI^®-126 Film and Bags are a convenient solution for packaging and protecting various metal parts, preventing rusting for up to two years by simply inserting a small gear or bolt.