STMicroelectronics has enhanced its STM32* LoRaWAN® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today.
80% of the application is already pre-configured: With its pre-configured software package 3 AxisFlex, Baumüller has reduced the programming effort for controlling the motion of up to three servo axes.
EPLAN eBuild, the new cloud software for generating electrical schematics or fluid power schematics, is being launched to coincide with the SPS 2019. It is geared towards users of EPLAN Platform 2.8 who want to take their first steps into the cloud environment. The requirements for using this brand new freemium software are being registered in the EPLAN ePulse cloud system and using EPLAN Platform, Version 2.8.