Parker Launches Flexible Thermal Gap Filler Solution
Parker Chomerics' new THERM-A-GAP CIP 35E offers 3.5 W/m-K conductivity and conformability for electronics cooling without stressing adjacent components.
www.parker.com
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is unveiling a new two-component (2k) dispensable thermal gap filler and cure-in-place (CIP) material offering 3.5 W/m-K thermal conductivity. THERM-A-GAP™ CIP 35E provides an alternative to hard-curing dispensable materials and an improvement over application methods associated with thermal gap pads.
THERM-A-GAP™ CIP 35E offers an excellent flow rate that enables high-speed dispensing at a large scale. With a 1:1 mix ratio and availability in packaging of various types and sizes, customers can take advantage of rapid dispensing through a static mixing tip fitted to either manual or automated equipment. For even greater convenience, no pre-mixing, weighing or degassing of the two components is necessary.
After curing, THERM-A-GAP™ CIP 35E serves as a low-hardness (50 Shore 00) gap pad that conforms to irregular shapes and maintains effective contact without transmitting compressive forces to adjacent electronics. Its ability to cure into complex geometries is ideal for the cooling of multi-height components on a printed circuit board (PCB) without the expense of a moulded sheet. The product also offers vibration damping attributes.
It offers benefits across electronics applications that include energy storage systems, power electronics, consumer electronics and a broad range of commercial and industrial devices. Any task involving the dissipation of heat between an electronic component, such as a semiconductor or battery, and a heat-dissipating surface will see gains - particularly those involving challenging or unconventional shapes.
Fully RoHS-compliant, important electrical isolating properties of THERM-A-GAP™ CIP 35E include: 8 kVac/mm dielectric strength (ASTM D149 test method); 1013 Ωcm volume resistivity (ASTM D257); 8.0 dielectric constant at 1,000 kHz (ASTM D150); and 0.009 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13).
A variety of kit sizes and configurations are available to suit any application, including handheld twin-barrel cartridges, SEMCO® tubes and pail containers, providing fill volumes from 45 to 10,452 cc.
www.parker.com
