SMT Hybrid Packaging with a new global launch: Temperature profiling in SMD lines

At the SMT Hybrid Packaging trade show in Nuremberg, Germany, Fluke Process Instruments will launch a new range of temperature profiling systems for quality control and optimization of soldering processes.

Illustration: Fluke Process Instruments offers ultra-compact temperature profilers for all kinds of solder machines or reflow ovens (pictured: DATAPAQ SelectivePaq)

The all-new family of DATAPAQ DP5 data loggers is augmented by the Insight Reflow Tracker professional software which quickly transforms the raw data into actionable information. Reflow soldering process optimization using the Easy Oven Setup recipe calculator is included as standard, as are SPC and trending analysis. These functions enable the operator to get the best out of every SMT production line. The launch furthermore includes two sensor holding frames that save setup time and ensure repeatability: an improved 12-thermocouple pallet for monitoring wave soldering process stability and a new, easy-to-use DATAPAQ Surveyor for reflow processes. The manufacturer will also showcase the world's smallest temperature profiler for selective mini-wave soldering: no more than 20 mm high and 40 mm wide including the thermal shield, DATAPAQ SelectivePaq enables reliable measurements even in very tight spaces.

Fluke Process Instruments at SMT Hybrid Packaging
05 – 07 June 2018, Nuremberg, Germany
Hall 4, Stand 437

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