29
'22
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Baumüller News
28
'22
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BYSTRONIC News
NEW BYBEND SMART: FASTER AND MORE PRECISE WITH EVEN MORE OPTIONS
The new ByBend Smart increases the flexibility and in particular the speed of bending. Thanks to its numerous functions and options, the new machine offers the decisive plus in bending technology at an attractive price.
28
'22
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Fraunhofer News
SENSORS LEARN HOW TO THINK
In the Fraunhofer lighthouse project NeurOSmart, Fraunhofer IPMS together with four other institutes (ISIT, IMS, IWU, IAIS) under the leadership of Fraunhofer ISIT are jointly researching particularly energy-efficient and intelligent sensors for the next generation of autonomous systems. In the process, the bridges between perception and information processing are being redefined by innovative electronics.
28
'22
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Toshiba News
TOSHIBA ANNOUNCES LOAD SWITCHES WITH ULTRA-LOW QUIESCENT CURRENT CONSUMPTION OF 0.08NA
Toshiba Electronics Europe GmbH (“Toshiba”) has launched three load switch products that deliver a remarkable decrease in quiescent current. The new devices are primarily intended for use in wearable and IoT applications where they will control the power supply for peripherals such as sensors.
28
'22
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Segula Technologies News
SEGULA TECHNOLOGIES SIGNS AN INTEGRATION AGREEMENT WITH CIDEIN TO ACCELERATE ITS COMMITMENT TO ELECTRONIC ENGINEERING AND EMBEDDED TECHNOLOGY
SEGULA Technologies and CIDEIN have joined forces to undertake a consolidation and development plan both in Spain and worldwide. Both companies announce the development of a printed circuit board design centre of excellence in Barcelona, which will be supported by SEGULA's network of offices to offer better proximity to national and international customers. CIDEIN, Spain's leader in component technology, printed circuit board design and electronic boards, has more than 18,000 references for high value-added projects. With this agreement, SEGULA Technologies plans to double its activity in Spain.
28
'22
Written on
CEVA News
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution, enabling secure data exchange between different chiplets within a Heterogenous System on Chip (HSoC).
28
'22
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RULAND RM News
Quick clamping shaft collars for packaging applications
Ruland quick clamping shaft collars require no tools for installation, adjustment or removal, making them a convenient and efficient choice for a variety of packaging equipment and applications.
28
'22
Written on
Nexperia News
Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V.
28
'22
Written on
Mitsubishi Electric News
