Gemu Group News

The new TIP 2.0

RFID solutions for GEMÜ diaphragms. The new TIP 2.0 is an optimized design for enabling communication with diaphragms as part of Industry 4.0 interconnectivity. Using RFID chips in conjunction with CONEXO, diaphragms can be positively identified and relevant data can be read out.

Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

3D SYSTEMS News

3D Systems Partners with Enhatch to Scale Personalized Medical Device Delivery

Today, 3D Systems (NYSE:DDD), the leading additive manufacturing solutions partner, and Enhatch Inc, the Hoboken, New Jersey and Tulsa, Oklahoma-based developer of the Intelligent Surgery Ecosystem, announced they have entered a partnership.

Nidec News

Dyneo+, the new range of connected motors with very high efficiency levels

Nidec Leroy-Somer announces Dyneo+, its new range of super premium efficiency permanent magnet-assisted synchronous reluctance motors.Combining the performance of synchronous permanent magnet technology with the easy set-up of induction motors, the Dyneo+motors have been designed to meet the most stringent requirements of industrial applications while offering them even more options using digitalization.

Mitsubishi Electric News

Mitsubishi Electric to Launch "MELSOFT Gemini" 3D Simulator

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that on April 28 it will launch the "MELSOFT Gemini" 3D simulator, which will expedite the design and construction of production facilities by using digital space to simulate and verify envisioned production operations in a 3-dimentional environment.

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