The new Stressometer Low-Force Flatness System enhances process control and yield, offering high accuracy and robustness in cold rolling mill applications.
Siemens’ MACHINUM software, integrated with Xcelerator, boosts U.S. CNC shopfloor performance using digital twins, real-time data, and adaptive machining control.
Acculon will use Circulor and Rockwell solutions to trace key battery materials and carbon emissions across the entire lifecycle, enhancing transparency and sustainability.
Parker Chomerics' new THERM-A-GAP CIP 35E offers 3.5 W/m-K conductivity and conformability for electronics cooling without stressing adjacent components.
Stabilus' IPR35 Smart integrates motor control in a compact unit (2-25mm spindle pitch, 50-350mm stroke) for plug-and-play automation in space-constrained designs.
Air Liquide invests over $50 million in a new U.S. gas plant, strengthening ultra-pure nitrogen and oxygen supply for the growing semiconductor industry by late 2027.