Allegro MicroSystems, Inc., a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced two new full-bridge gate drivers for automotive and industrial applications. New drivers enable fewer external components and smaller footprints while improving performance.
Siemens Digital Industries Software today announced that its Calibre® nmPlatform now enables designers to leverage the newest GlobalFoundries (GF) silicon photonics platform. GF’s next generation, monolithic platform, GF Fotonix is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.
New design, additional functions: SensoPart equips its VISOR® range of vision sensors with an upgraded version of the SensoWeb monitoring software. Differentiated statistical evaluations can now also be displayed in addition to the current status.
The latest enhancement to the PowerFlex® 6000T drive now accepts up to 13.8 kV primary voltage, nearly twice the input voltage, in a footprint that is only 2310…3010 mm (7.58…9.87 feet) wide. The drive can be applied to 3…4.16 kV applications with high voltage input built in. Plus, high-voltage feeds can be directly connected to the drive from the main distribution line without additional step-down transformer or substation equipment, reducing costs.
The German Federal Ministry for Economic Affairs and Climate Action awarded the innovative ADHESO gripping technology from SCHUNK with the IKU 2022. The bio-inspired, energy-saving method of handling facilitates sustainable automation processes in many areas. SCHUNK developed the technology together with the startup company INNOCISE.
Iristick, leading supplier of industrial and medical smart glasses announced the launch of Microsoft Teams video conferencing solution on their products.
The Edge AI and Vision Alliance announced Blaize as winner of the 2022 Edge AI and Vision Product of the Year - Best Edge AI Processor - for the Blaize® Pathfinder P1600 Embedded System on Module (SoM).
Mitsubishi Electric Corporation announced today that the company has developed an on-orbit additive-manufacturing technology that uses photosensitive resin and solar ultraviolet light for the 3D printing of satellite antennas in the vacuum of outer space.
At COP26 (the 26th Conference of the Parties to the United Nations Framework Convention on Climate Change) held in 2021, TDK was a featured speaker at an off-site session organized by Hitachi, Ltd. about its procurement partners. There, TDK presented its ongoing initiatives to contribute to the reduction of CO2 emissions in its supply chain.
On Booth 543, E2S will be exhibiting their new UL464 and UL1638 approved warning signals for use in fire and gas detection systems suitable for hazardous areas, industrial, marine and harsh environments.