ST News

STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative semiconductor materials, announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.

Hexagon Manufacturing Intelligence News

Hexagon introduces Elements to help engineers design increasingly complex products with system-level modelling

Hexagon’s Manufacturing Intelligence division has today introduced Elements, new simulation software that helps engineering teams understand the behaviour of systems that are becoming increasingly complex in modern products. Using the software, teams can evaluate the performance and feasibility of new design concepts quickly to inform more efficient product development and reduce risk and cost.

GE News

GE Grid Solutions uses digital x-ray to assess substation health for Petrobras in Brazil

GE Renewable Energy’s Grid Solutions Services team used digital X-ray technology, guided by the same principle utilized in the healthcare industry, to complement the preventive maintenance in Petrobras’ gas insulated substation (GIS), in the Abreu e Lima Refinery (RNEST), state of Pernambuco (Brazil).

JUMO News

Highest Safety Standards for the Filling Level Measurand

Using the name JSP (JUMO Safety Performance), JUMO has already been bundling the company's expertise in the SIL (Safety Integrity Level) and PL (Performance Level) fields for years. Now the JSP portfolio is being expanded to include another important measurand − it enables the reliable detection and measurement of process-critical point levels and filling levels for liquids. JUMO offers solutions for the measuring point up to SIL 2 according to IEC 61508.

Mitsubishi Electric News

Mitsubishi Electric to Launch Contact Image Sensor in New KD-CXF Series

Mitsubishi Electric Corporation has announced that its new KD-CXF series of contact image sensors (CISs) equipped with the industry's deepest1 depth of field2 will launch this December beginning with the KD6R1064CXF-NL model. CISs are widely used in manufacturing to inspect product surfaces for scratches, dirt, miscoloring or mispositioning of printed labels, plastic film, etc.

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