Yokogawa Electric Corporation announces that it has developed the ZR802S explosion- proof converter and will be releasing it for sale as part of its OpreX Analyzers lineup in all markets on December 12.
As the leading full-line supplier for glass mat plants, Voith supplies the stock preparation including fiber feeding, approach flow system, HydroFormer, binder section and the FiberDry drying concept.
As one of the fastest growing end mill and drill areas in the Seco Tools portfolio, the company’s solid-round tool reconditioning service experienced an increase in use by over 30% in 2022.
Almost exactly 31 years ago on 22.11.1991 our SSB Wägetechnik GmbH was founded, at that time still under the name SSB Steuerungsbau GbR (Lebrato and Partner).
Mitsubishi Electric Corporation announced today its development of a quantum artificial intelligence (AI) technology that automatically designs and optimizes inference models to downsize the scale of computation with quantum neural networks. The new quantum AI technology can be integrated with classical machine learning frameworks for diverse solutions.
Manufacturers of Ethernet switches and other industrial networking devices often make vague claims like “weatherproof” or “dust-resistant” about their products to sway customers.
Rather than being released into the atmosphere and exacerbating the problem of climate change, CO2 can also be used as a raw material for substances required in industrial processes, such as formic acid or methanol.
The most remarkable aspect of technology is its constant development and improvement. Slimmer laptops, smaller phones, and medical devices designed to be unobtrusive and barely visible to the naked eye. Can I use 3D-Circuits to outperform the flat PCBs?.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative semiconductor materials, announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.