HARTING USA

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

CONTA-CLIP

KDSI-SR modular cable entry installed from the outside

Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time saving feed-through of cables with and without plugs.

DENSO

DENSO President announces a €63 billion (¥10 trillion) R&D investment plan

In his first European public appearance as President and COO of DENSO, the Fortune 500 advanced automotive technology supplier, Shinnosuke Hayashi revealed that the business plans to invest €63 billion (¥10 trillion) in research and development over the next ten years in line with its pursuit of zero emissions and zero traffic fatalities within mobility and society.

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