06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

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Anritsu News

Anritsu bringing its latest Signal Generation and Analysis Solutions to European Microwave Week 2023

Anritsu will showcase its advanced testing solutions for signal generation and analysis at the European Microwave Exhibition, the largest trade show in Europe for microwaves and RF.

Read more…

06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

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Tasking News

TASKING introduces a new version of Safety Checker

Safety Checker v3.0 improves usability and simplifies the process of ensuring functional safety even further.

Read more…

06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-06T00:00:00+00:00" | date "longDate" }}

U Blox News

U-blox introduces its first multi-mode cellular and satellite IoT module with embedded positioning

The u-blox SARA-S520M10L is designed to ensure seamless connectivity even when no terrestrial cellular network is available.

Read more…

06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-06T00:00:00+00:00" | date "longDate" }}

Yamaha Motor News

Yamaha Robotics to present advanced assembly automation at Productronica 2023

Yamaha Robotics will display the latest-generation 1 STOP SMART SOLUTION at A3.323 at Productronica 2023, bringing together the complete set of new YR series printers, surface-mounters and inspection machines.

Read more…

06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-06T00:00:00+00:00" | date "longDate" }}

OMRON News

New Omron relay extends current capacity for EV charging and UPS

Omron Electronic Components Europe has expanded its G7EB high-power relay portfolio, with a new 120A carry type for control and instrumentation applications including PV inverters, electric vehicle charging and uninterruptible power supplies.

Read more…

06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-06T00:00:00+00:00" | date "longDate" }}

Dürr Systems AG News

DÜRR AND HSM DEBUT NEW LOW-PRESSURE SPRAY GUN

The new low-pressure spray gun for colour changes in just a few seconds without the need for solvents.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

Bunting europe News

Metal Separation from Plastic Flake

UK plastic recycler uses Bunting Metal Separation Module to separate ferrous and non-ferrous metal from plastic flake, featuring Vibratory Feeders, Drum Magnet, and Eddy Current Separator.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

Exel Composites News

Composites for sustainable telecommunications

By Juha Pesonen, segment owner for telecommunications at composite radome manufacturer Exel Composites, explains how locally manufactured composite materials can deliver more sustainable outcomes for the telecoms sector.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

Emerson Automation Solutions

Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023 (Booth SL-6107)

Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

HARTING USA

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

Read more…

Case studies

Only the changes count

Anritsu bringing its latest Signal Generation and Analysis Solutions to European Microwave Week 2023

Anritsu will showcase its advanced testing solutions for signal generation and analysis at the European Microwave Exhibition, the largest trade show in Europe for microwaves and RF.

TASKING introduces a new version of Safety Checker

Safety Checker v3.0 improves usability and simplifies the process of ensuring functional safety even further.

U-blox introduces its first multi-mode cellular and satellite IoT module with embedded positioning

The u-blox SARA-S520M10L is designed to ensure seamless connectivity even when no terrestrial cellular network is available.

Yamaha Robotics to present advanced assembly automation at Productronica 2023

Yamaha Robotics will display the latest-generation 1 STOP SMART SOLUTION at A3.323 at Productronica 2023, bringing together the complete set of new YR series printers, surface-mounters and inspection machines.

New Omron relay extends current capacity for EV charging and UPS

Omron Electronic Components Europe has expanded its G7EB high-power relay portfolio, with a new 120A carry type for control and instrumentation applications including PV inverters, electric vehicle charging and uninterruptible power supplies.

DÜRR AND HSM DEBUT NEW LOW-PRESSURE SPRAY GUN

The new low-pressure spray gun for colour changes in just a few seconds without the need for solvents.

Metal Separation from Plastic Flake

UK plastic recycler uses Bunting Metal Separation Module to separate ferrous and non-ferrous metal from plastic flake, featuring Vibratory Feeders, Drum Magnet, and Eddy Current Separator.

Composites for sustainable telecommunications

By Juha Pesonen, segment owner for telecommunications at composite radome manufacturer Exel Composites, explains how locally manufactured composite materials can deliver more sustainable outcomes for the telecoms sector.

Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023 (Booth SL-6107)

Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023.

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

International