05
'23
Written on
Bunting europe News
05
'23
Written on
Exel Composites News
Composites for sustainable telecommunications
By Juha Pesonen, segment owner for telecommunications at composite radome manufacturer Exel Composites, explains how locally manufactured composite materials can deliver more sustainable outcomes for the telecoms sector.
05
'23
Written on
Emerson Automation Solutions
Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023 (Booth SL-6107)
Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023.
05
'23
Written on
HARTING USA
3D-Circuits - Enabling 3D-Placement Of Electronic Components
Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.
05
'23
Written on
Pailton Engineering News
Design flexibility is key to helping start ups get going
By Roger Brereton, Head of Sales at steering parts manufacturer Pailton Engineering, explores the reasons why start ups often struggle to bring vehicles to market.
05
'23
Written on
Rohde & Schwarz
Rohde & Schwarz and Greenerwave collaborate to verify RIS modules and drive 6G research
Reconfigurable intelligent surfaces (RIS) are drawing attention in the wireless industry due to their potential for an efficient 5G mmWave rollout as well as future 6G applications.
05
'23
Written on
Leica Geosystems News
HEXAGON REACHES NEW HEIGHTS WITH LAUNCH OF LEICA BLK2FLY AUTONOMOUS INDOOR SCANNING
The BLK2FLY now unlocks a new level of autonomy to build digital twins of entire structures, inside and outside.
05
'23
Written on
CONTA-CLIP
KDSI-SR modular cable entry installed from the outside
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time saving feed-through of cables with and without plugs.
04
'23
Written on
DENSO
DENSO President announces a €63 billion (¥10 trillion) R&D investment plan
In his first European public appearance as President and COO of DENSO, the Fortune 500 advanced automotive technology supplier, Shinnosuke Hayashi revealed that the business plans to invest €63 billion (¥10 trillion) in research and development over the next ten years in line with its pursuit of zero emissions and zero traffic fatalities within mobility and society.
04
'23
Written on
Sivers Semiconductors News
