10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron introduces three product lines based on next-generation Intel Atom processors

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Seco News

SECO introduces new COM Express Type 6 module powered by Intel

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Siemens News

NEW SIEMENS SOFTWARE AUTOMATICALLY IDENTIFIES VULNERABLE PRODUCTION ASSETS

SINEC Security Guard is a cloud-based cybersecurity software that provides full risk transparency and cybersecurity management of OT assets.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Pratt & Whitney News

PRATT & WHITNEY ANNOUNCES NORTH AMERICAN TECHNOLOGY ACCELERATOR

Key projects include additive repairs for critical GTF engine components.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Datalogic News

DATALOGIC SHOWCASES ITS ATR SOLUTION AT PASSENGER TERMINAL EXPO 2024

Showcase highlights will include the latest innovations and solutions aimed at enhancing efficiency, safety, and the passenger experience at airports around the world.

Read more…

09 {{ "2024-04-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-09T00:00:00+00:00" | date "longDate" }}

Schmersal News

Schmersal is to showcase its new door handle system at Hannover Messe 2024

Schmersal is set to showcase its new DHS door handle system at Hannover Messe 2024: the door handle unites the functions of a robust door handle with display of individual machine statuses using illumination in the handle itself.

Read more…

09 {{ "2024-04-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-09T00:00:00+00:00" | date "longDate" }}

Softing Industrial USA

dataFEED OPC Suite Increases Application Security With OPC UA Tunnel and Includes InfluxDB Support

Softing Inc., a leading global provider of products for industrial automation, IT networks and automotive electronics, announces the release of dataFEED OPC UA Tunnel, a new method to help customers secure communications between PLCs and business applications. Additionally, dataFEED OPC Suite version 5.30 can now move process data from PLCs to an InfluxDB database for storage.

Read more…

09 {{ "2024-04-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-09T00:00:00+00:00" | date "longDate" }}

Comau

Comau Showcases the Power of Automation with New Robots and New Solutions at Automate 2024

Comau will be exhibiting at Chicago’s McCormick Place from May 6-9, 2024 in Booth 4441 to present its digital-driven technology.

Read more…

09 {{ "2024-04-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-09T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity

As part of a larger company initiative to increase supply chain resiliency, this initiative will focus on specialized 40nm processes for Microchip.

Read more…

Market Overview

The Transition of the HVAC Industry to New Refrigerants

Technical Articles

binder Connector presents PBC 15 female field-wirable and male panel mount

Case studies

Why ToF cameras are ideal for industrial automation applications

Kontron introduces three product lines based on next-generation Intel Atom processors

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

SECO introduces new COM Express Type 6 module powered by Intel

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

NEW SIEMENS SOFTWARE AUTOMATICALLY IDENTIFIES VULNERABLE PRODUCTION ASSETS

SINEC Security Guard is a cloud-based cybersecurity software that provides full risk transparency and cybersecurity management of OT assets.

PRATT & WHITNEY ANNOUNCES NORTH AMERICAN TECHNOLOGY ACCELERATOR

Key projects include additive repairs for critical GTF engine components.

DATALOGIC SHOWCASES ITS ATR SOLUTION AT PASSENGER TERMINAL EXPO 2024

Showcase highlights will include the latest innovations and solutions aimed at enhancing efficiency, safety, and the passenger experience at airports around the world.

Schmersal is to showcase its new door handle system at Hannover Messe 2024

Schmersal is set to showcase its new DHS door handle system at Hannover Messe 2024: the door handle unites the functions of a robust door handle with display of individual machine statuses using illumination in the handle itself.

dataFEED OPC Suite Increases Application Security With OPC UA Tunnel and Includes InfluxDB Support

Comau Showcases the Power of Automation with New Robots and New Solutions at Automate 2024

Comau will be exhibiting at Chicago’s McCormick Place from May 6-9, 2024 in Booth 4441 to present its digital-driven technology.

Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity

As part of a larger company initiative to increase supply chain resiliency, this initiative will focus on specialized 40nm processes for Microchip.

International

Market Overview

Technical Articles

Case studies

Three module platforms with Intel Atom® series x7000E/x7000RE, Intel® Processor N series, and Intel® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel® Next Gen Atom® processors.

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

SINEC Security Guard is a cloud-based cybersecurity software that provides full risk transparency and cybersecurity management of OT assets.

Key projects include additive repairs for critical GTF engine components.

Showcase highlights will include the latest innovations and solutions aimed at enhancing efficiency, safety, and the passenger experience at airports around the world.

Schmersal is set to showcase its new DHS door handle system at Hannover Messe 2024: the door handle unites the functions of a robust door handle with display of individual machine statuses using illumination in the handle itself.

Comau will be exhibiting at Chicago’s McCormick Place from May 6-9, 2024 in Booth 4441 to present its digital-driven technology.

As part of a larger company initiative to increase supply chain resiliency, this initiative will focus on specialized 40nm processes for Microchip.

International

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.