GEA has scored its best result to date in the climate assessment of the Carbon Disclosure Project (CDP). With an overall score of “A-,” the Group now meets the criteria for the leadership level and thus ranks among the leading group in the sectoral and regional benchmark.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), will be presenting Computer-on-Modules, SBCs and motherboards of all leading standards with the latest processors from Intel®, AMD and NXP, as well as x86 and ARM-based computer systems and panel PCs at embedded world in Nuremberg between February 25 and 27, 2020. Visitors will also be able to learn about the steps required to implement a digital transformation strategy. Kontron's expertise in this context ranges from consulting, hardware and software development to complete solutions and EMS and ODM services. Kontron will also be providing an outlook on the trends that will shape the industry in 2020 and beyond in hall 1, booth 1-478.
GE Hitachi Nuclear Energy (GEH) and TerraPower have announced a collaboration to pursue a Public Private Partnership to design and construct the Versatile Test Reactor (VTR) for the U.S. Department of Energy (DOE).
Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.
ABB and Ericsson, together with Swisscom, showcase for the first time, how easily and effectively robots can be controlled over wide distances utilizing the real-time communication capabilities of 5G.
If the weight of PCD tools is reduced, as a rule significantly higher cutting data can be used. Along with design freedom, the possibility of weight optimisation is one of the crucial advantages offered by 3D printing. Due to the specially developed structures inside the tool, which cannot be manufactured conventionally, the weight can be reduced significantly.