www.magazine-industry-usa.com
15
'26
Written on Modified on
SABIC Launches LNP THERMOCOMP Compounds
New LNP THERMOCOMP OFM76XXP and OFM76EXP compounds deliver excellent impact strength and dimensional stability, a robust comparative tracking index and resistance to thermal shock.
www.sabic.com

SABIC has announced a new series of LNP THERMOCOMP compounds engineered for high-power, high-voltage electric drive and power module applications, including insulated gate bipolar transistor (IGBT) power switching devices. The new LNP THERMOCOMP OFM76XXP and OFM76EXP grades, based on polyphenylene sulfide (PPS) resin, deliver high impact strength, dimensional stability, a robust comparative tracking index (CTI-PLC 0), and resistance to thermal shock to address increasingly stringent design requirements.
Material Properties and Mechanical Resiliency
The high-performance materials are designed for use in power modules for high-voltage (800V and above) electric vehicle traction inverters and fast chargers, as well as renewable energy systems and industrial automation applications such as robotics. They feature high heat resistance, dielectric strength for effective electrical insulation, and UL94 V0 flame retardancy.
The compounds combine the highest CTI level (PLC 0) and high strength and insulation performance under thermal aging with enhanced toughness. The materials achieve 90 percent retention of tensile strength and insulation capability after 1000 hours of heat aging at 200°C. Compared to polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, they provide superior dimensional stability and resistance to thermal shock. These new grades support miniaturized, lightweight designs with thin-wall flame retardancy capability (UL94 V0 at 0.4mm). Furthermore, they can be produced in white or light colors to maintain the visibility of compulsory QR codes printed on IGBTs.
Next-Generation Laser Marking and Structural Adhesion
The next-generation LNP THERMOCOMP OFM76EXP grade offers enhanced laser marking contrast, high impact strength, strong adhesion to silicone-based sealants, and elevated resistance to stress cracking. In addition to IGBT module insulation base plates, these materials can be utilized in DC power transmission systems, high-voltage inverters and breakers, integrated busbar brackets, and renewable energy infrastructure.
Additional Context
This section details technical specifications not included in the original news release.
The Comparative Tracking Index (CTI) measures the electrical breakdown (tracking) properties of an insulating material under electrical stress in wet or contaminated conditions. A Performance Level Category of PLC 0 indicates that the material can withstand a voltage of 600 volts or higher without forming conductive tracks on its surface.
In high-power modules like traction inverters operating at 800V and above, high switching frequencies induce high thermal gradients and rapid dI/dt transients. These operational stresses cause cyclic thermal expansion and contraction. Standard thermoplastic housings made of PBT or PPA often suffer from delamination at the interface with the silicone gel encapsulant, which leads to moisture ingress and arc-tracking failures.
By utilizing a high-toughness polyphenylene sulfide (PPS) matrix, the LNP THERMOCOMP compounds maintain physical adhesion to silicone-based sealants, preventing localized delamination. This thermal shock resistance prevents micro-cracking during rapid temperature transitions from -40°C to 150°C, ensuring the long-term isolation barrier of the module.
Edited by Romila DSilva, Induportals Editor, with AI assistance.
www.sabic.com

