Advantech Launches High Performance Compact Fanless IPC with Intel^® 6th/7th Generation Core™ i Socket Type Platform

Advantech (2395.TW), a leading global provider of intelligent systems and platform solutions across multiple vertical markets, is pleased to announce the launch of MIC-7700, a high performance, compact, fanless IPC with the latest Intel^® Core i™ socket-type CPU. MIC-7700 provides highly flexible expansion capability and excellent computing through the Intel^® 6th/7th generation Core™ i socket type processor, DDR4 memory, optional I/O modules and unique Advantech i-module products. Together, these will satisfy applications in the factory and machine automation fields, which need expansion capability and cost-effectiveness. The compact size and ruggedized design of MIC-7700 withstand the demands of harsh industrial environments, to ensure stability and durability.

Reliable High Performance Platform with Fanless Design
MIC-7700 is a fanless system equipped with the latest Intel^® 6th/7th generation Core™ i socket-type processor. This unique combination of socket-type CPU and fanless design not only provides high performance computing ability, but also avoids the problem of dust accumulation, greatly increasing product reliability and reducing equipment maintenance cost. Another advantage of fanless design is that it is silent, which means that the MIC-7700 can be employed in noise-sensitive applications that still require high performance. MIC-7700 supports Microsoft Windows 7/10, Linux OS, and Advantech’s SUSIAccess remote management software utility for convenient management and system protection.

High Performance-to-Cost Solution with Strong I/O Flexibility
MIC-7700 supports 2x GbE LAN, 8x USB3.0 ports, 6x serial ports, triple displays, and various optional modules, such as 2 LANs, isolation COM, and 32-bit GPIO modules. The rich I/O features can satisfy most factory automation applications. In addition, 7 kinds of unique Advantech i-module products give MIC-7700 even more powerful expansion ability via the PCIe/PCI slots, including 2x 2.5” hot-swappable HDD trays, to support customer add-on cards and massive storage requirements. The customer can assembly those modules, accessories, and their own add-on solutions quickly and safely because of the innovative mechanical design of MIC-7700. This flexible-capacity solution decreases assembly time on the customer’s production line, saves maintenance cost in the field, and increases RMA efficiency, enabling customers to use a single IPC platform for multiple and varied applications. Furthermore, the shortened lead times of Advantech’s configure-to-order service (CTOS) helps customers reduce their time-to-market, yet with a cost-effective solution.

Ruggedized Industrial Design Aimed at the IIoT Market
MIC-7700 is a compact, fanless, industrial system that supports wide range of power inputs, and operating temperatures of -10~50 °C. The ruggedized chassis design and cast aluminum heatsink offer vibration and shock protection, as well as a passive thermal solution that ensures silent operation. Designed for the industrial automation market and to withstand 24/7 operation in harsh environments, all electronic components are rugged and satisfy certification standards for environmental protection, EMI/ESD tolerance, and high-voltage surge requirements (2KV). This high-performance platform with rich I/O and multiple displays provides an attractive solution for a variety of IIoT applications.

Key Features
• Intel^® 6th/7th generation Core™ i Socket Type Platform
• 2 x GbE LAN, 8 x USB 3.0, and 6 x COM ports
• Compatible with Advantech’s unique expansion i-modules
• Supports 2 LANs, isolation COMs, 32-bit GPIO modules
• 9 ~ 36 V DC input power
• Wide operating temperature range: -10 ~ 50 °C

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