Texas Instruments launches 300mm chip production in Sherman, expanding U.S. semiconductor capacity for analog and embedded devices across key industries.

New high-density converters and modules enable efficient 12V-to-800V architectures, supporting growing AI workloads with improved energy conversion and power scalability.

Massive multi-fab expansion across Texas and Utah boosts production for smartphones, EVs, and AI, securing U.S. tech and supply chain leadership.

Texas Instruments technologies will help enable NVIDIA's future 800V high-voltage DC power-distribution systems for next-generation AI data centers.

The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.

Texas Instruments (TI) announced a long-term collaboration with Delta Electronics, a global power and energy management manufacturer, to create next-generation electric vehicle (EV) onboard charging and power solutions.

The new products include a lowest-drift isolated Hall-effect current sensor for high-voltage systems and a portfolio of current shunt monitors that eliminate the need for an external shunt resistor for nonisolated voltage rails.

Designers can create reliable, small and affordable cleaning systems for automotive and industrial applications using TI's ULC technology.

Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements.

Engineers can add Bluetooth Low Energy technology to more products than ever before with TI's new CC2340 wireless MCUs. Texas Instruments today expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth^® Low Energy (LE) at half the price of competing devices.