22
'23
Written on
Infineon News
www.infineon.com
16
'23
Written on
Infineon's new ISOFACE portfolio of digital isolators offers robust high-voltage isolation, best-in-class efficiency and noise immunity
Digital isolators have become the preferred choice in many modern designs because of the many benefits they offer.
16
'23
Written on
Infineon to lead European research project on Industry 5.0 for more sustainability and resilience in European manufacturing
Infineon Technologies AG is taking over coordination of the wide-scope European research project AIMS5.0 ("Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0").
11
'23
Written on
Infineon's CALYPSOTM move enables interoperable ticketing solutions based on open standards
Infineon Technologies AG has developed CALYPSOTM move, a secure memory for contactless ticketing, to meet the specific requirements of each transport operator and authority.
11
'23
Written on
Infineon’s CoolSiC XHP 2 high-power modules enable energy-efficient electrified trains to drive decarbonization
To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains.
05
'23
Written on
Infineon's new wireless power transmitter IC is ideal for charging up to 50 W
Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.
01
'23
Written on
New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems
Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.
17
'23
Written on
Hi-Lo Systems supports Infineon’s OPTIGA TPM firmware programming to accelerate device manufacturers’ time-to-market
Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company announced their partnership in the area of Trusted Platform Module (TPM) security chips.
04
'23
Written on
Infineon streamlines its decarbonization profile: Division for industrial applications to operate under the name Green Industrial Power (GIP)
Infineon Technologies AG has changed the name of its Industrial Power Control (IPC) Division to Green Industrial Power (GIP). The semiconductor manufacturer is thus highlighting its consistent alignment with the Decarbonization and Digitalization trends. For the newly named Division, green energies are key growth drivers for the business.
20
'23
Written on
