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PCIM 2025

Nuremberg • 06 MAY '25

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Würth Elektronik News

Würth Elektronik at PCIM Expo 2025

Discover cutting-edge power electronics solutions as Würth Elektronik eiSOS presents its latest advancements at PCIM 2025, driving efficiency and innovation in energy systems.

  www.we-online.com
Würth Elektronik at PCIM Expo 2025

Würth Elektronik eiSos Group will be represented with its own booth at the PCIM Expo in Nuremberg, May 6–8, 2025. At the leading trade show for power electronics, the renowned component manufacturer will present its innovative products and participate in the seminar program with two interesting lectures. Booth highlight: SPICE icon Mike Engelhardt.

“Electronic application developments of the future will depend on high switching frequencies and maximum efficiency, with a minimal footprint,” stresses Alexander Gerfer, CTO of Würth Elektronik eiSos Group. “Trade visitors at our booth can experience the state of the art of components in terms of their functionality, energy efficiency, and miniaturization. We will also be there to support our customers, partners, and startups in their development work with a wealth of services and specific advice.”

At Booth 342 in Hall 6, Würth Elektronik eiSos Group will showcase a range of products and innovations designed to meet the growing demand for power electronics both now and in the future.

Comprehensive range of components
The WE-PMFI is a new shielded flat-wire inductor that combines high rated currents with low DC losses in a compact design. A high-current inductor, the WE-HCMD, has been specially developed for TLVR (Transient Load Voltage Regulation) applications and has no problems combining high saturation currents of up to 190 A with low RDC, and a coupling factor of up to 0.98.

The VariableStepDown MicroModules MagI³C-VDMM from Würth Elektronik offer highperformance power modules in various packages. Their compact design and optimized EMC behavior make them ideal for point-of-load DC/DC applications or as a replacement for linear regulators.

Another highlight is the expansion of the WE-HCFT series of THT high-current inductors: featuring a new metal alloy and the use of flat wire for the coil, to achieve current carrying capacity of up to 100 A saturation in excess of 260 A, minimal core losses, and stable inductance across all operating temperatures.

Additionally, the WE-XHMI series now also includes four new sizes of power inductors. The new generation excels with optimized performance – ideal for developing efficient high-current switching regulators.

The WE-MXGI molded power inductor, on the other hand, scores with extremely low RDC and AC losses as well as its innovative iron alloy material. It offers high efficiency and current-carrying capacity in a compact design, perfect for high-frequency DC/DC converters based on modern GaN or SiC transistor technologies.

Thanks to the wide range of optocouplers and digital isolators, optimal isolation solutions can be realized for a wide range of applications. Würth Elektronik also provides the appropriate connection technology for high-current applications with its tried-and-tested REBCUBE terminals.

Strong partnerships with leading semiconductor companies
At its booth, Würth Elektronik will also be presenting turnkey solutions arising from its multifaceted cooperation with IC manufacturers.

Highlights include a fault-tolerant six-phase motor driver developed together with STMicroelectronics as well as a modular multilevel converter from its collaboration with Infineon.

Also at the booth: the Nexperia Motor Driver Kit featuring over 50 Würth Elektronik components. The innovative kit includes a motor controller board, a three-phase inverter, and a Leonardo board. This enables a wide range of applications, from power tools to wireless devices to electric forklifts. The Nexperia Motor Driver Kit is also ideal for evaluating three-phase brushless DC (BLDC) motor applications, and is flexible enough to be adapted to many other motor types.

QSPICE demo station with Mike Engelhardt
The well-known developer of the LTspice simulation software will personally introduce and explain the new tool – QSPICE. The upgrade now includes the latest components with wide bandgap (WBG) materials, such as silicon carbide and gallium nitride semiconductors. Engelhardt has been programming physical simulators since 1975, holds eight important patents, and has given presentations on SPICE (Simulation Program with Integrated Circuit Emphasis) in 48 countries.

Contributions to the seminar program:
  • Lecture: Dr. Heinz Zenkner, EMC specialist at Würth Elektronik, on Sunday, May 4, 2025, 2:00 pm,on: “Safeguarding Industrial Interfaces: Reliable Protection Against Transients with Modern TVS Diodes”
  • Poster presentation: Christian Merz, Würth Elektronik, on Wednesday, May 7, 2025, 12:45 pm: “Development and Characterization of an SMD Qi-Compliant Wireless Power Coil”

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