Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

PARALIA is a new EU Horizon Research and Innovation Actions Project funded under the HORIZON-CL4-2022-DIGITAL-EMERGING-01-03 Call, coordinated by Aristotle University of Thessaloniki in Greece. It will run from January 2023 to June 2026.

MaxLinear, Inc. (NASDAQ: MXL), and Sivers Wireless, a subsidiary of Sivers Semiconductor AB, announced today the joint development of a V-Band RF/Modem solution that enables disruptive unlicensed point-to-point microwave radios in the 57-71 GHz band.